RO4003C 4-Layer 4.8mm Thick PCB with ENIG Finish and Countersunk Holes – Applications and Process Overview
1.Introduction of RO4003C
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Available in various configurations using 1080 and 1674 glass fabric styles, RO4003C laminates deliver consistent dielectric constant (Dk) and low loss characteristics. They can be processed using standard epoxy/glass methods, offering a cost-effective alternative to traditional microwave laminates without requiring special through-hole treatments. RO4003C materials are non-brominated and not UL 94 V-0 rated. Their thermal expansion coefficient (CTE) closely matches that of copper, ensuring excellent dimensional stability and reliable plated through-hole integrity even under severe thermal conditions. With a Tg exceeding 280°C, RO4003C maintains stable expansion properties throughout circuit processing.
2.Key Features
Dielectric Constant: 3.38 ±0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz, 0.0021 at 2.5 GHz
Thermal Coefficient of Dk: +40 ppm/°C
Thermal Conductivity: 0.71 W/m/°K
CTE: X: 11 ppm/°C, Y: 14 ppm/°C, Z: 46 ppm/°C
Moisture Absorption: 0.06%
3.Benefits
Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower cost
Suitable for performance-sensitive, high-volume applications
Competitively priced
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO4003C |
| Layer Count | 5-layer |
| Board Dimensions | 60mm x 60mm (±0.15mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | No |
| Finished Board Thickness | 4.8mm |
| Finished Cu Weight (Inner/Outer) | 1oz (35μm) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | Black |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Via Treatment | Filled with resin and capped on surface |
| Countersunk Holes | Conical, 90 degree |
5.PCB Stackup (4-Layer Rigid Structure)
Copper_layer_1 - 35 μm
Rogers 4003C Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
Prepreg RO4450F X 2 -0.204mm
Rogers 4003C Core - 1.524 mm (60mil)
Prepreg RO4450F X 2 -0.204mm
Rogers 4003C Core - 1.524 mm (60mil)
Prepreg RO4450F X 2 -0.204mm
Copper_layer_3 - 35 μm
Rogers 4003C Core - 0.508 mm (20mil)
Copper_layer_4 - 35 μm
6.PCB Statistics:
Components: 2
Total Pads: 7
Thru Hole Pads: 3
Top SMT Pads: 4
Bottom SMT Pads: 0
Vias: 5
Nets: 7
7.Typical Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
